Manufacturing is the heart of the company
Customer request - Product development - Prototype - Prototype verification - Verification series - Series production
Modification of the delivered sample according to requirements - Verification of the functionality of the new sample - Verification series - Serial production
Acceptance of production documents from the customer - Assessment by the TPV (Technical Preparation of Production) department - Serial production
Our developers will adapt to your requirements and prepare a possible solution for you. However, this procedure brings difficulties in the form of follow-up verifications and testing, and we implement it only exceptionally.
Depending on the severity of the technological change, we adapt the individual steps of the production process. It can be, for example, a mechanical change to the product, a change in functionality through SW or HW modifications, etc. Depending on the severity of the change, further process steps are determined.
The final assembly includes painting, gluing, potting and other electromechanical assembly steps, including output inspection and packaging. The necessary administration follows and the prototype is handed over to the customer.
The customer verifies the functionality of the prototype and performs its trial testing. Based on the resulting functional assessments and measurements, the prototype may be modified, or depending on the complexity of the modification, its production may be repeated.
If the final form of the prototype is approved by the customer, the production of verification series follows. Validation series are already produced using a standard production process, including all operations as on a real production line. There may be several verification series, depending on the complexity of the product and the customer's requirements.
If all the tests performed on the verification series were successful, the whole process is considered finished and the so-called transfer to series production will take place. All steps are taken to be able to produce the product in large series.
In addition to standard SMD mounting, other technologies are used, thanks to which a complete mounted and tested printed circuit board is available at the end of the production line. The following are operations related to the final treatment of the PCB - painting, potting, final assembly.
We carry out mounting and soldering of PCBs for SMD and classic components based on the supplied input data and material. For specific orders, we will ensure the complete implementation of PCB from input data only (design and production of PCB, provision of material, processing of PCB). The production process is controlled by audits within the framework of the ČSN EN ISO 9001:2000 standard. If you are interested, we will process the PCB with lead soldering technology.
And what else can you imagine under the term DPS deployment?
THT components are those whose leads pass through the DPS (Through Hole Technology). We mainly install transformers, chokes, large capacitors, power resistors, semiconductors, LEDs and other components according to the nature of the product.
Assembling THT components is a combination of the work of trained specialists, machinery and efficient PCB design. The design effort is always to eliminate the amount of THT components, which is usually unavoidable in power applications. Components are placed with a high degree of focus and precision. All steps of the process take place gradually, so any defects can be identified immediately. The subsequent soldering processes are carried out with regard to the chosen design of the product.
After mounting each PCB, an inspection is performed using the AOI (Automatic Optical Inspection) optical system, which detects any errors that occurred during the mounting of components on the PCB. 3D AOI technology increases the success of detection of real errors with a minimum of false reports, simplifies programming and faster creation of the program itself, and provides more accurate data for statistical process control (SPC).
3D technology enables measurement in the entire volume down to the voxel level. Thanks to this, the inspection is independent of the optical parameters of the inspected objects and ensures very high stability without additional tuning of the system.
Errors found facilitate possible correction by a production worker.
We make custom functional testers according to the needs and specifications of the customer. Testers examine products based on a wide range of specifications. The measured quantities are usually voltage levels, currents, power or electrical properties of the components. During the first interoperational testing, the functionality of the product is checked and the relevant SW is loaded. After testing, the product is marked and proceeds to the next operation. stored in the database and can be found in our database (ERP system).
Each of our products undergoes a HV (high voltage) test, which checks the safety of the device with regard to leakage currents / insulation condition.
The production of our own testers is a great challenge for our developers and is the utilization of all the knowledge they have acquired during the development of the relevant electronics. The know-how we acquire by producing our own testers is really a great value for our company.
Varnishing is an important step to protect components from various environmental influences (e.g. moisture and dust). Only a combination of state-of-the-art technology and high-quality materials will ensure proper protection. Varnishing is carried out depending on the customer's request, or after consultation with him. It is necessary to take into account the environment in which the product will be used.
Potting and gluing are two technologies that ensure anti-vibration protection of components, protection against moisture, dust, or the action of other aggressive substances. We use the highest quality materials for both operations.
Using this technology, we produce sensors and platforms, in the development of which we cooperate with leading institutes and universities.
With sputtering equipment, we are able to sputter metal layers of Au, Pt, Ta, NiCr, Ti, W on a wide range of substrates, from corundum to silicon to flexible Kapton films. Standard dimensions of substrates for sputtering are up to 10 x 10 cm.
Using photolithography, we prepare structures for further processing using the lift-off method or ion-milling technology. The equipment of the workplace makes it possible to realize structures with a resolution of 5 μm. We are able to graphically process the customer proposal according to the requirements of photolithography (drawings for the production of chrome masks).
The laser is ideal for setting up and testing thin film resistors, resistor matrices and other thin film applications. The laser (3 W Q-switched YAG laser at 532 nm) evaporates a thin layer of metal in the designed meander so that the desired resistance value is reached. The system allows you to trim within a range 0,1 Ω-1000 M Ω.
Wet processes of chemical etching, galvanic strengthening of gold and nickel, humidity chamber.
Screen printing is intended for printing conductive and dielectric pastes. The technological equipment makes it possible to realize printing from the design of the screen motif to the actual implementation. The device allows you to print a motif with a resolution of 50 μm depending on the paste used. We print on various types of ceramic substrates and foils.
The dosing device is intended for precise application of conductive or dielectric pastes. For sensor applications, it is used for applying and fixing contacts with dielectric paste, strengthening contact surfaces with conductive paste, etc. Another possibility is the selective application of sensitive materials.
The device enables spot welding of wires with a diameter of 0.2 – 0.3 mm and lengths from 10 mm to 100 mm onto metal layers prepared by thin or thick layer technology.
The device enables spot welding of wires with a diameter of 0.2 – 0.3 mm and lengths from 10 mm to 100 mm onto metal layers prepared by thin or thick layer technology.
Without this technology, the production of power resistors or other passive winding elements cannot be done.
Our production needs the supply of cables and wires that are modified by cutting, stripping, crimping and other procedures.
Design proposals | tools and instruments | press molds | injection molds | assembly of machine units | classic, semi-automatic, automatic metal processing | turning, milling, grinding, drilling, cutting, wire cutting, tapping, gouging
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